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ANDK-program and burn in socket eMMC153-169 to USB3.0

Country/Region china
Company Shenzhen HongYi Electronics Co., Ltd.
Categories Precision Molding
Telephone +8618824309157
ICP License Issued by the Chinese Ministry
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ANDK-program and burn in socket eMMC153-169 to USB3.0

parameter

Application ICeMMC153/169 (eMMC2.x~eMMC4.x~eMMC5.x)
Device Functiondata recovery
IC size9*11mm 10*11mm 11.5*13mm 12*16mm 12*18mm 14*18mm
eMMC/eMCP thickness0.8mm - 1.5mm
SoftwareBasic section version
InterfaceUSB3.0 port

PRODUCT FEATURES

Small spacing

minimum pitch of 0.2mm

test accuracy

The test is accurate and the error rate is 0.001 %

High temperature

high temperature: 175 ℃, low temperature: -55

long service life

Life span more than 300,000 times, 2-3 times that of other similar brands

Advantage


  • 1.support many NAND flash chips;

  • 2.USB3.0 standard , it can be recovered the data fast;

  • 3.Android NAND flash check and data recovery and read/write well.

Product image

Product Tags:

gift wrapping paper

  

low temperature

  
Cheap ANDK-program and burn in socket eMMC153-169 to USB3.0 for sale
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