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High-speed Chip shooter KE-2070/chip mounter

Categories SMT pick and place machine/chip mounter
Place of Origin: Japan
Brand Name: JUKI
Model Number: KE-2070/chip mounter
Certification: PSE
Price: 1
Packaging Details: Wooden box
Delivery Time: 30DAYS
Payment Terms: T/T
Supply Ability: 100 SET/MONTH
MOQ: 1
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High-speed Chip shooter KE-2070/chip mounter

With the addition of the optional MNVC, the component range can be increased even more for greater flexibility.


Chip

23,300CPH(laser centering/Optimum)(0.155Sec./chip)

18,300CPH(laser centering/IPC 9850)

IC

4,600CPH (vision centering with optional MNVC)

One multi-nozzle laser head (6 nozzles)

From 0402 (01005) to 33.5mm square components

Vision centering system (optional, featuring bottom, side, and back lighting, all ball recognition)

1 Actual throughput may vary.

2 Please download brochure for details


Board size : M size (330×250mm)

L size (410×360mm)

L-Wide size(510×360mm) (option)

E size (510×460mm)*1

Component size :

Laser recognition : 0402 (01005) ~□33.5mm

Vision recognition

Standard camera : □3mm*2 ~□33.5mm

High-resolution camera (option) : 1.0×0.5mm*3 ~□20mm

Placement speed

Chip

Optimum : 0.155Sec./chip(23,300CPH)

IPC9850 : 18,300CPH

IC*4 : 4,600CPH*5

Placement accuracy

Laser recognition : ±0.05mm(Cpk≧1)

Vision recognition: ±0.04mm

Feeder inputs : Max. 80 on 8mm T/F*6


1 Please ask for details on E size board.

2 When using MNVC. (option)

3 When using both high-resolution camera and MNVC. (option)

4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.

(CPH=number of components placed for one hour)

5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.

6 Including matrix tray changer, max 110.

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Product Tags:

chip shooter

  

BGA assembly machine

  

smd equipment

  
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