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Digital Radio Antennas High Frequency Pcb , OEM High Precision Rohs Printed Circuit Boards

Categories High Frequency PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Material: High Frequency Material
Layer: 2
Color: /
Min line space: 4mil
Min line width: 4mil
Copper thickness: 1OZ
Board size: 69*69mm
Panel: 1
Surface: HASL-LF
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Digital Radio Antennas High Frequency Pcb , OEM High Precision Rohs Printed Circuit Boards


Digital Radio Antennas High Frequency Pcb , OEM High Precision Rohs Printed Circuit Boards


Specification:


High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.


Advantage
OEM High Precision Digital Radio Antennas High Frequency PCB
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


Parameter:

PRODUCT’S DETAILS
Raw MaterialHIgh Frequency Material
Layer Count2-Layer
Board Thickness1.6mm
Copper Thickness35UM
Surface FinishImmerison Silver
Solder Mask/
Silkscreen/
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement60*159mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

We can offer production with high quality and competitive:

ItemMass ProductionPilot Run Production
CapacityCapacity
Layer Counts1L_18L, HDI20-28 , HDI
MaterialFR4
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate4 layers -- 10 layers12 layers
FR4+Ro4350 , Rogers3003+FR4
Maximum Size610mm X 1200mm1200 - 2000MM
Board Outline Tolerance±0.15mm±0.10mm
Board Thickness0.125mm--6.00mm0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm)± 8%±5%
Thickness Tolerance( t<0.8mm)±10%±8%
Minimum Line / Space0.10mm0.075mm
Trace width Tolerance15%-20%10%
Minimum Drilling Hole (Mechanical)0.2mm0.15mm
Minimum laser hole0.1mm0.075mm
Hole Position/hole Tolerance±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single0.075MM0.05MM
OutLayer Copper Thickness17um--175um175um--210um
InnerLayer Copper Thickness17um--175um175um--210um
Mini Solder Mask Bridge0.05mm0.025mm
Impedance Control Tolerance±10%±5%
Surface FinishingHASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
1-2L Lead-time3-7 days1-2 days
4- 8L Lead-time7-10 days2-7 days
10-18L Lead-time10-15 days4-9 days
20-28L Lead-time15-20 days
Acceptable File FormatALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality StandardsIPC-A-600F and MIL-STD-105D CHINA GB<4588>

Parameter

XCE PCB technical specifications
MaterialHigh Frequency Material
Layer No.2
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin,

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating


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