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BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

Categories BGA X Ray Inspection Machine
Brand Name: UNICOMP
Model Number: AX9100
Certification: CE, FDA
Place of Origin: China
MOQ: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Delivery Time: 30 days
Packaging Details: Wooden Case, Waterproof, Anti-collision
Name: X-ray Inspection Machine
Max.Loading Size: Φ570mm
Max.Inspection Area: 450mm x 450mm
Industry: Electronics Industry
Power: 220AC/50Hz
Power Consumption: 1.6kW
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BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine


Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system.


ItemDefinitionSpecs
System ParametersSize1350(L)x1250(W)x1700(H)mm
Weight1900kg
Power220AC/50Hz
Power Consumption1.6kW
X-ray TubeTypeClosed
Max.Voltage130kV
Max.Power40W
Spot Size7μm
X-ray SystemIntensifierFPD
Monitor22 ‘’LCD
System Magnification1600 X
Detection RegionMax.Loading SizeΦ570mm
Max.Inspection Area450mm x 450mm
X-ray Leakage<1μSv/h

X-ray Inspecting Features:


(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.


(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.


(3) The test preparation time is greatly reduced.


(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.


(5) Double layers board and multi-layer boards only one check (with layered function).


(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.


Test Images:


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