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TPS5430DDAR Integrated Circuit IC Chip Buck Switching Regulator IC Positive Adjustable 1.221V 1 Output 3A 8-PowerSOIC

Categories Integrated Circuit IC Chip
Model Number: TPS5430DDAR
Part Status: Active
Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Adjustable
Number of Outputs: 1
Voltage - Input (Min): 5.5V
Voltage - Input (Max): 36V
Place of Origin: Original
Brand Name: Original Manufacturer
Certification: Rosh
MOQ: 1
Price: Negotiation
Packaging Details: Original Packing
Delivery Time: In stock
Payment Terms: TT, Paypal, Western Union And So On
Supply Ability: 80000
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TPS5430DDAR Integrated Circuit IC Chip Buck Switching Regulator IC Positive Adjustable 1.221V 1 Output 3A 8-PowerSOIC


TPS5430DDAR Integrated Circuit IC Chip Buck Switching Regulator IC Positive Adjustable 1.221V 1 Output 3A 8-PowerSOIC


Part StatusActive
FunctionStep-Down
Output ConfigurationPositive
TopologyBuck
Output TypeAdjustable
Number of Outputs1
Voltage - Input (Min)5.5V
Voltage - Input (Max)36V
Voltage - Output (Min/Fixed)1.221V
Voltage - Output (Max)32.04V
Current - Output3A
Frequency - Switching500kHz
Synchronous RectifierNo
Operating Temperature-40°C ~ 125°C (TJ)
Mounting TypeSurface Mount
Package / Case8-PowerSOIC (0.154", 3.90mm Width)
Supplier Device Package8-SO PowerPad
Base Part NumberTPS5430

FEATURES APPLICATIONS


· Wide Input Voltage Range: 5.5 V to 36 V

· Up to 3-A Continuous (4-A Peak) Output Current

· High Efficiency up to 95% Enabled by 110-mW Integrated MOSFET Switch

· Wide Output Voltage Range: Adjustable Down

· Consumer: Set-top Box, DVD, LCD Displays

· Industrial and Car Audio Power Supplies

· Battery Chargers, High Power LED Supply

· 12V/24V Distributed Power Systems

DESCRIPTION


to 1.22 V with 1.5% Initial Accuracy As a member of the SWIFT™ family of DC/DC


· Internal Compensation Minimizes External Parts Count

· Fixed 500 kHz Switching Frequency for Small

regulators, the TPS5430 is a high-output-current PWM converter that integrates a low resistance high side N-channel MOSFET. Included on the substrate with the listed features are a high performance


Filter Size voltage error amplifier that provides tight voltage


· Improved Line Regulation and Transient Response by Input Voltage Feed Forward

· System Protected by Over Current Limiting and Thermal Shutdown

regulation accuracy under transient conditions; an under-voltage-lockout circuit to prevent start-up until the input voltage reaches 5.5V; an internally set slow-start circuit to limit inrush currents; and a voltage feed-forward circuit to improve the transient


· –40°C to 125°C Operating Junction response. Other features include an active high

Temperature Range enable, over current protection and thermal


· Available in Small Thermally Enhanced 8-Pin SOIC PowerPAD™ Package

· For SWIFT Documentation, Application Notes and Design Software, See the TI Website at

shutdown. To reduce design complexity and external component count, the TPS5430 feedback loop is internally compensated.

The TPS5430 device is available in a thermally enhanced, easy to use 8-pin SOIC PowerPAD™ package. TI provides evaluation modules and the SWIFT™ Designer software tool to aid in quickly achieving high-performance power supply designs to meet aggressive equipment development cycles


These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.


ORDERING INFORMATION


TJOUTPUT VOLTAGEPACKAGEPART NUMBER
–40°C to 125°CAdjustable to 1.22 VThermally Enhanced SOIC (DDA)(1)TPS5430DDA

(1) The DDA package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS5430DDAR). See applications section of data sheet for PowerPAD™ drawing and layout information.


ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (1)(2)


VALUEUNIT

VI


Input voltage range

VIN–0.3 to 38

V

ENA–0.3 to 7
VSENSE–0.3 to 3
BOOT–0.3 to 48
BOOT-PH10
PH (steady-state)–0.6 to 38
PH (transient < 10 ns)–1.2
IOSource currentPHInternally Limited
IOLeakage currentPH10mA
TJOperating virtual junction temperature range–40 to 125°C
TSTG Storage temperature–65 to 150°C
Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds300°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.


DISSIPATION RATINGS(1)(2)


PACKAGETHERMAL IMPEDANCE JUNCTION-TO-AMBIENT
8 Pin DDA (2-layer board with solder)(3)33°C/W
8 Pin DDA (4-layer board with solder)(4)26°C/W

(1) Maximum power dissipation may be limited by overcurrent protection.

(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information.

(3) Test board conditions:

a. 3 in x 3 in, 2 layers, thickness: 0.062 inch.

b. 2 oz. copper traces located on the top and bottom of the PCB.

c. 6 thermal vias in the PowerPAD area under the device package.

(4) Test board conditions:

a. 3 in x 3 in, 4 layers, thickness: 0.062 inch.

b. 2 oz. copper traces located on the top and bottom of the PCB.

c. 2 oz. copper ground planes on the 2 internal layers.

d. 6 thermal vias in the PowerPAD area under the device package.


RECOMMENDED OPERATING CONDITIONS


MINNOMMAXUNIT
VINInput voltage range5.536V
TJOperating junction temperature–40125°C
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