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8-layers HDI+ SMT + plug-in + back soldering Low Volume SMT PCB Service SMT DIP Processing Quick Turn Prototypes

Categories SMT PCB Service
Brand Name: China chao sheng
Model Number: 8-layer HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: Negotiation
Supply Ability: 5-200K/pcs per month
Delivery Time: 6-30day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Certification: ISO/UL/RoHS/TS
Payment Terms: T/T, Western Union
Surface finishing: ENIG
Base material: FR4
Min. line spacing: 3 Mil (0.075 mm)
Board thickness: 1.6mm-3.2mm
Min. line width: 0.075mm/0.1mm(3mil/4mil)
Product name: Camera PCB Assembly
Material: FR4/94v0/Aluminum/cem-1 cem-3/
Solder mask: Green,Blue
Service: PCB&PCBA
Solder mask color: Green
Type: PCB assembly
Layer: 1-24layers
Usage: PCB assembly
Color: Green Black Bule White
Pcb standard: IPC-A-610 D
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8-layers HDI+ SMT + plug-in + back soldering Low Volume SMT PCB Service SMT DIP Processing Quick Turn Prototypes

8-layers HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing,carton packaging SMT PCB Service,+ SMT + plug-in + back soldering


Product Description

  1. 8-layer HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing,carton packaging SMT PCB Service
  2. 8-layer automotive product PCBA
  3. 8-layer HDI1 step, 1550*598mm, PCB production component purchase SMT DIP processing
  4. Detailed Product Description

PCBA processing method

  1. PCB production + it contains SMT, DIP, TEST,
  2. Helpset, assembled OEM factory
  3. Electronic materials supply or our purchasing method

PCBA multiple packaging methods:

  1. Inner box for electrostatic film simple packaging + wooden box or carton packaging
  2. inner box plastic box + wooden box or carton packaging
  3. vacuum packaging + wooden box or carton packaging
  4. Packing is done according to your requirements

Quality Processes:

1. IQC: Incoming Quality Control (Incoming Materials Inspection)

2. First Article Inspection (FAI) for every process

3. IPQC: In Process Quality Control

4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949


Design file format:
1. Gerber RS-274X, 274D, Eagle and AutoCAD's DXF, DWG
2. BOM (bill of materials)
3. Pick and place file (XYRS)


Advantages:
1. Turnkey manufacturing or quick-turn prototypes
2. Board-level assembly or complete system integration
3. Low-volume or mixed-technology assembly for PCBA
4. Even consignment production
5. Supoorted capabilities


PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB Assembly services:


SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection


Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material


Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Cheap 8-layers HDI+ SMT + plug-in + back soldering Low Volume  SMT PCB Service  SMT DIP Processing Quick Turn Prototypes for sale
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