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FR-4 TG170 SMT PCB Service , High Power Optical Module Board 0.10mm Min Hole

Categories SMT PCB Service
Brand Name: China chao sheng
Model Number: CSPCB1527
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
Price: usd2.68/pcs
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 200K/pcs per month
Delivery Time: 15-20day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas: Communication Optical Module 5G PCBA
Product Structure: 8 Layers 3 Steps + Embedded Copper + PCBA
Material: FR-4, TG170ISOLA370HR+M6
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Minimum Hole: 0.10mm
Surface Finishing: Nickel Palladium + Gold Finger 30U "
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
E-Test: 100%
Impedance Value: ± 10%
  • Product Details
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FR-4 TG170 SMT PCB Service , High Power Optical Module Board 0.10mm Min Hole

8LayersHDI 3m buried material + FR-4TG170 High Power Power Optical Module PCB Power Optical Module Board Module Solar Power Bank Circuit Metal Core Pcb ManufacturerPCB , Opticalmodule product Flexib le Rigid PCB rigid flex board

Product Description

  1. PCBA Technology Capability
  2. Smallest chip placement:0201
  3. Automated axial insertion and Automated radial insertion
  4. Computer controlled Pb free wave soldering system
  5. High speed Pb free surface mount production lines
  6. Providing electronic components purchase service for the customers
  7. ICT on line inspection, PCBA function test equipment, Visual inspection

Product Details

  1. Number of layers: 6L soft and hard combined HDI first-order layered board,
  2. Plate thickness: 1.60mm
  3. Process structure: 3m buried material + FR-4TG170, impedance Ω ± 10%,impedance Ω±10%, resin plug hole + copper fill hole
  4. Buried copper block + nose PAD + minimum hole 0.20mm
  5. Surface treatment: Shen Jin + electricity gold 3u"
  6. Minimum hole copper: 25um
  7. Quantities range from prototype to volume production.
  8. 100% E-Test
  9. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NOsupplierSupply material nameMaterial origin
1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
4SanTiePI, covering membraneJapan
5Born goodFR-4,PI,PP,Copper berthshenzhen, China
6A rainbowPI, covering membrane,Copper berthTaiwan
7teflonHigh frequency materialsThe United States
8RogersHigh frequency materialsThe United States
9Nippon SteelPI, covering membrane,Copper berthTaiwan
10sanyoPI, covering membrane,Copper berthJapan
11South AsiaFR-4,PI,PP,Copper berthTaiwan
12doosanFR-4,PPSouth Korea
13Tai Yao plateFR-4,PP,Copper berthTaiwan
14AlightFR-4,PP,Copper berthTaiwan
15YaoguangFR-4,PP,Copper berthTaiwan
16YalongFR-4,PPThe United States
18OAKBuried, buried resistance, PPJapan
19United States 3MFR-4,PPThe United States
20BergsCopper and aluminum matrixJapan
21The suninkTaiwan
23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
24YasenPPI, covering membraneChina jiangsu
25Yong Sheng TaiinkChina guangdong panyu
27Transcriptceramic materialTaiwan
28HOMEceramic materialJapan
29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements

Quick Detail:

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

7. IC programming

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

OEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module ProductOEM Flexible Rigid PCB HDI 3m Buried Material FR4 TG170 For Optical Module Product

Cheap FR-4 TG170 SMT PCB Service , High Power Optical Module Board 0.10mm Min Hole for sale
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