Detected circuit board | Through-hole and mixed-technology SMT solder paste printing and
reflow furnace front and reflow oven circuit board inspection |
Detection method | TOC algorithm, Histogram algorithm, Match algorithm, Short
algorithm, OTHER algorithm, CREST algorithm, PIN algorithm and many
other leading international algorithms, the system automatically
sets its parameters according to different detection points |
camera | High-speed smart digital camera |
Resolution / Vision Range / Speed | (Standard) 15μm/Pixel FOV : 38mm×31mm Detection speed <200ms/FOV |
| (Optional) 8μm/Pixel FOV : 20mm×16mm Detection Speed
<200ms/FOV |
light source | Bright RRGB four-color coaxial ring tower LED light source (color
light) |
Programming mode | Manual programming, automatic programming, automatic import of CAD
data into the component library |
remote control | In the LAN, remote operation via TCP / IP network, view, start or
stop the operation of the machine, modify the program and other
operations. |
Detection coverage type | Solder Paste Printing: Yes, No, Offset, Less Tin, More Tin, Broken
Circuit, Continuous Tin, Pollution, etc. |
| Part defects: missing parts, offsets, skew, monuments, side
elevations, overturned parts, wrong parts (OCV), breakages,
reversals, etc. |
| Solder joint defects: tin, tin, vacant solder, tin, and copper foil
contamination. |
Special features | Supports automatic program retrieval, multi-board multi-program
detection functions, and positive and negative program detection
functions. |
Minimal part testing | 8μm: 01005chip & 0.3pitch IC. |
SPC and process control | Record test data and conduct statistics and analysis throughout the
process. Local area network can view production status and quality
analysis through remote control or remote monitoring. It can output
report formats such as Excel, Txt, and Word. |
Bar code system | Automatic barcode recognition (1D or 2D code). |
Server mode | With the central data server, several AOI data can be centrally
managed. |
operating system | Windows XP Professional. |
Inspection result output | 22-inch LCD monitor, OK/NG signal, send data file to Repair station
(option) |
AOI system parameters | |
PCB size range | 50×50mm(Min)~510×500mm(Max) |
PCB thickness range | 0.3 to 5 mm |
PCB clamping system edge clearance | TOP:3.5 mm Bottom:3.5 mm |
The maximum PCB weight | 3KG |
PCB curvature | <5mm or 2% of the PCB diagonal length |
Clear height above and below PCB | Top Side: 30 mm PCB Bottom Side: 85 mm |
Conveyor system | Bottom-up fixed, automatic compensation for PCB bending
deformation, automatic feeding in and out of plate, flat belt,
automatic adjustment of width |
Conveyor height above ground | 890 to980mm |
Conveyor Flow / Time | It can be set as Left→Right→Left/Plate-out time by button: 4
seconds |
X/Y platform driver | Screw and AC servo motor drive, PCB fixed, Camera moves in X/Y
direction; each one is CTQ certified |
power supply | AC230V 50/60Hz less than 1.5KVA |
Pressure | 0.4~0.8Mpa |
Before and after device communication | Smema |
equipment weight | About 700KG |
Equipment dimensions | 900 × 1300 × 1565mm (L × W × H) does not include the height of the
signal lamp |
Environmental temperature and humidity | 10 to 35°C 35 to 80% RH (without condensation) |
Equipment safety regulations | Comply with CE safety standards |