XCKU035-1FBVA676I IC FPGA 312 I/O 676FCBGA

XCKU035-1FBVA676I

Products Description:

Xilinx® UltraScale™ architecture comprises high-performance FPGA, MPSoC, and RFSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements. Artix® UltraScale+ FPGAs: Highest serial bandwidth and signal compute density in a cost-optimized device for critical networking applications, vision and video processing, and secured connectivity. Kintex® UltraScale FPGAs: High-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost. Kintex UltraScale+™ FPGAs: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Virtex® UltraScale FPGAs: High-capacity, high-performance FPGAs enabled using both monolithic and next-generation SSI technology. Virtex UltraScale devices achieve the highest system capacity, bandwidth, and performance to address key market and application requirements through integration of various system-level functions. Virtex UltraScale+ FPGAs: The highest transceiver bandwidth, highest DSP count, and highest on-chip and in-package memory available in the UltraScale architecture. Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope. Zynq® UltraScale+ MPSoCs: Combine the Arm® v8-based Cortex®-A53 high-performance energy-efficient 64-bit application processor with the Arm Cortex-R5F real-time processor and the UltraScale architecture to create the industry's first programmable MPSoCs. Provide unprecedented power savings, heterogeneous processing, and programmable acceleration. Zynq® UltraScale+ RFSoCs: Combine RF data converter subsystem and forward error correction with industry-leading programmable logic and heterogeneous processing capability. Integrated RF-ADCs, RF-DACs, and soft decision FECs (SD-FEC) provide the key subsystems for multiband, multi-mode cellular radios and cable infrastructure.

Technological Parameters:

Customer Service:

1. Do you support BOM lists?

Of course, we have a professional team to provide BOM.

2. Shown below. Behind MOQ?

Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.

3. What about lead time?

After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.

4. Our advantage?

1. Stable and sufficient supply

2. Competitive pricing

3. Rich BOM experience

4. Perfect after-sales service

5. Professional test certificate

5. Our service?

Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...

6. Transportation:

DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping

Product Photos:

Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc.

We have established stable business relationships with product developers such as SAMSUNG, MICRON, ALTERA, NXP, ATMEL, INFINEON, AOS, TOSHIBA, HYNIX, TI, NS, ST, ADI, VISHAY, MAXIM, ON, KEC, ROHM, WINBONOD, as well as European and American component developers, and enjoy franchise distribution rights for multiple company components. The company keeps a large amount of inventory year-round and provides professional ordering services to customers.

Since its establishment, Dingcen International (Hong Kong) Co., Ltd. has provided electronic components through cooperation with the original factory and top agents, ensuring that all sold components are original and genuine, with 100% guaranteed quality