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PB MDF Oriented Strand Board OSB Presses Assembly

Categories Multi Opening Press
Brand Name: SufoTech
Place of Origin: China
MOQ: 1
Price: USD+1,000,000.00~3,000,000.00
Payment Terms: T/T, L/C
Delivery Time: 10 months
Packaging Details: Wooden package
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PB MDF Oriented Strand Board OSB Presses Assembly

100-700Cbm/Day MDF/HDF Multi-Opening Press Line with Advanced Technology

Fully Automatic 100~700 Cbm Per Day MDF/HDF Multi-Opening Press Production Line


Description


The 180-700m³/day MDF/HDF production line uses raw material through chips preparation, fiber manufacturing, glue dosing system, forming and hot pressing, cooling &trimming and sanding section to make MDF/HDF board. The final size can be 4 x 8, 6 x 8, 6 x 9, 4 x 12, 6 x 12, 6 x 18. The MDF/HDF board has homogeneous structure, smooth surface, good machining specification and manufacture performance. It is the ideal substitute of nature wood.


the multi-opening vacuum press machine is used mainly for printed circuit boards.
A printed circuit board is absolutely essential to electronic devices. The multi-opening vacuum press machine is used to produce copper-clad laminates (CCL) which is a material of the printed circuit board. Also, this press machine attaches prepreg (sheet which is made from glass cloth (insulation layer) impregnated with thermosetting resin such as epoxy) and copper foil.
The large multi-opening vacuum press machine with a Heating plate size of more than 1m × 2m and which has 10 or more openings, or 20 or more openings is used.
The multi-opening vacuum press machine is also used in the multi-layering process where electronic circuits are printed and etched on this CCL and then insulation layer and copper foil are stacked.
Highly multi-layered printed circuit boards with more than 50 layers are used for base stations of mobile phones and supercomputers which are essential to our modern information society, and extremely high precision is required for its lamination. Our multi-opening vacuum press machine plays an active role in this field


Summary of process flow



  • Chips Preparation Section
  • Fiber Preparation Section
  • Glue Dosing System
  • Drying Section
  • Forming and Hot Press section
  • Sanding and Cutting Line

Main technical data


ItemUnitSpecification
Capacitym³/d100~700
Width of production linefeet4,6
Final board thicknessmm8~30
Final board widthmm915~1830
Final board lengthmm1830~5490
Press LayersdaylightMax. 32

Key equipment of production line

  • Drum chipper

  • Refiner

  • Forming line

  • Hot press

  • Sanding line


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