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...Thermally Conductive silicon Pad 3.0W/m-k Product description : BERGQUIST GP3000S30 Soft thermal conductive material with substrate gap filling. Also known as GAP PAD 3000S30. The new model is GAP PAD TGP 3000. Product Features : Under very low pressure, low S-Series thermal...
...Thermally Conductive silicon Pad 3.0W/m-k Product description : BERGQUIST GP3000S30 Soft thermal conductive material with substrate gap filling. Also known as GAP PAD 3000S30. The new model is GAP PAD TGP 3000. Product Features : Under very low pressure, low S-Series thermal... more
Brand Name:BERGQUIST
Model Number:GP3000S30
Place of Origin:China
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...0W Thermal Pad Thermally Conductive Silicon Pad Thermal Management Material Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting...
...0W Thermal Pad Thermally Conductive Silicon Pad Thermal Management Material Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting... more
Brand Name:Ziitek
Model Number:TIF7200Q
Place of Origin:China
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...0W Ultra-High Thermal Conductive Silicone Gel For Telecom Industry TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®070-11 has a higher viscosity, which effectively prevents filler separation from the silicone...
...0W Ultra-High Thermal Conductive Silicone Gel For Telecom Industry TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®070-11 has a higher viscosity, which effectively prevents filler separation from the silicone... more
Brand Name:ZIITEK
Model Number:TIF070-11
Place of Origin:China
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TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery Product descriptions TIF500-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating ...
TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery Product descriptions TIF500-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating ... more
Brand Name:Ziitek
Model Number:TIF500-40-11US
Place of Origin:Vietnam
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1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(mm) 0.3~10.0 ASTM d374 Density(g/cc) 3.0 ASTM D792 Hardness...
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(mm) 0.3~10.0 ASTM d374 Density(g/cc) 3.0 ASTM D792 Hardness... more
Brand Name:AOK
Model Number:TP300
Place of Origin:China
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Product Description: The Thermal Conductive Pad comes in two colors - Grey and Blue - to suit your preferences and requirements. The grey color is perfect for applications where aesthetics are important, while the blue color is ideal for high-temperature ...
Product Description: The Thermal Conductive Pad comes in two colors - Grey and Blue - to suit your preferences and requirements. The grey color is perfect for applications where aesthetics are important, while the blue color is ideal for high-temperature ... more
Model Number:M-TP200
Place of Origin:China
Certification:Rohs,Reach,UL
